Surface Mount Technology (SMT)

 

High-complexity SMT assembly for stable, right-first-time PCB assembly

As a specialist contract electronics manufacturer in the UK, we provide high-precision SMT capability designed for OEMs who need consistent, repeatable electronics manufacturing for established, long-running products. Our focus is on eliminating variability, improving yield and giving engineering, production and operations teams confidence that every batch will perform exactly as expected.

Whether your assemblies require fine-pitch placement present a challenge due to dense multilayer layouts or require a through-hole reflow process, our SMT lines deliver predictable output that integrates smoothly into your wider manufacturing process.

 

Why OEMs Choose Our SMT Capability

Built for complex designs

Our SMT service is engineered to support the demanding requirements of modern, high-reliability PCB assembly, including:

 

  • Fine-pitch components
  • Quad Flat No-Lead packages (QFN)
  • Land Grid Arrays (LGA)
  • Micro Ball Grid Arrays (micro BGA)
  • Chip Scale Package (CSPs)
  • High Density (HDI) and multi-layer boards
  • Mixed-technology assemblies

This capability ensures your designs are placed accurately, consistently and to the correct requirement every time.

 

 

 

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Built for Stability, Repeatability & Risk Reduction

We combine process control with modern equipment to ensure stable, repeatable performance:

  • We run twin Europlacer-based SMT lines, high-speed pick-and-place machines (each up to 30,000 components an hour)
  • Fully automated screen printing with integrated paste inspection
  • Reflowoven profiling by KIC
  • Automatic board handling on both lines to support higher-volume requirements
  • AOI on all surface mount assemblies
  • Shared program architecture, meaning jobs can run on either line
  • Intelligent trolley-based loading system that ensures rapid, accurate changeovers
  • Common platform architecture, mitigating the downtime risk associated with single-line dependence

This dual-line configuration allows us to maintain throughput even in the event of equipment failure, a significant operational advantage for OEMs relying on predictable delivery.

 

 

 

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Our SMT Electronics Capability & Experience

We have over three decades of successful SMT placement experience, supporting increasingly complex component technologies.

Our capability and experience includes:

 

  • 20+ years placing advanced packages, from BGAs to micro BGAs
  • Placement range from 01005 (0.25 × 0.125 mm) up to 99 mm² components
  • Europlacer odd-form capability for non-standard components
  • Feeder capacity of 264 × 8 mm reels, supporting extremely large Bills of Materials (BOM)
  • Smooth handling of tubed and trayed components
  • We have placed over 155 million parts
  • We have produced over 9 million assemblies
  • Full compatibility with:
  • Land Grid Arrays (LGAs)
  • Quad Flat No-Lead packages (QFNs)
  • Chip Scale Packages (CSPs)

This breadth of capability supports complex, long-running product lines that require absolute repeatability.

 

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A foundation for dependable PCB assembly

Our SMT capability forms the technical backbone of our wider electronics manufacturing offering. By ensuring accuracy, consistency and resilience at the earliest stage of assembly, we help OEMs reduce operational noise, improve predictability and build the long-term supply confidence their products demand.

Electronics made effortless — starting with the precision of your SMT process.

 

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Speak to us about your needs

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